AdvanceTEC is the market leader of turn-key design build cleanrooms for nanotechnology and semiconductor device fabrication “fabs.” Our advanced 3D BIM / VDC modeling, high purity process integration, and fast-track clean build methodologies have been leveraged by leading tech companies ranging from venture capital backed start-ups to global technology leaders.
Our skillset serves customers well across projects ranging from pilot lines, high volume fabs, or foundry applications—regardless of wafer size or if your process is CMOS, GaAs, GaN, or other advanced composite materials. We’ve delivered Class 10 / ISO 4 photo bays, Class 100 / ISO 5 deposition areas, Class 1,000 / ISO 6 metrology & metals cleanroom areas, and more to our customers. AdvanceTEC has segment expertise in-house to handle your most pressing technology and project challenges.
Typical Cleanroom Considerations
Although each cleanroom and process have specific requirements and challenges, below are common cleanroom considerations for device fabrication fabs:
Cleanroom Fab Design Considerations
Bay & chase cleanroom design configuration
Ballroom and RAF (raised access floor) cleanroom design and configuration
FFU (Fan Filter Unit) air delivery and plenum ceiling
Plenum modules 100% filter coverage with flush grid and integrated lighting and sprinkler
Tool-set layout and process utility generation and distribution
Trace metals or metals free cleanrooms
EMI shielded rooms and service utilities
Vibration free zones
Light and sound abatement
Radiant cooled areas with ultra-low air velocities
Fabrication Cleanroom Systems Experience
Building Automation Systems (BAS) / Building Management Systems (BMS)
High-purity gas cabinets, distribution panels and ventilated enclosures, and gas bunkers
High purity piping and tubing systems
Ultra-Pure Water (UPW) skids and distribution loops
Toxic Gas Monitoring Systems (TGMS)
Scrubbed exhaust systems
Chemical dispense systems
Environmental and particle monitoring systems
Common Nanotech Cleanroom Specifications
Specification for device fabrication cleanrooms vary based on process type, line width, and wafer size requirements. Core specifications include ISO Classifications and ACR (air change rates).
Fab cleanrooms requirements can range from ISO 4 (Class 10) to ISO 6 (Class 1000) cleanrooms
Certain operations may have an ISO 7 (Class 10,000) or ISO 8 (Class 100,000) background, but all considerations are handled on a project by project basis
Air change rates per hour vary by ISO classification:
AdvanceTEC is the industry leading design & build cleanroom and process integration provider where experts with decades of segment experience apply the latest digital tools and technologies to deliver outstanding outcomes for customers.